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900V

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产品·PRODUCT
Super Junction

900V

   
Part Number
BVDSS
[V]
RDS(ON)
[mΩ]
ID
[A]
Vth
[V]
Qg
[nC]
Option
Package
TSC005N090C 900 1490 5 4 13.6 - DPAK
TSZ005N090C 900 1490 5 4 13.6 - IPAK-PE

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SYS-421GE-TNRT
Key Features Key Applications - High Performance Computing - VDI - AI/Deep Learning Training - Media/Video Streaming - Cloud Gaming - Animation and Modeling - Design & Visualization - 3D Rendering - Diagnostic Imaging Key Features 1. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 2. 13 PCIe Gen 5.0 X16 FHFL Slots AIOM/OCP 3.0 Support 3. 8x 2.5" Hot-swap SATA drive bays 8x HOT SWAP 2.5” SATA/SAS (AOC required) 8x2.5" Hot-swap NVMe drive bays 4. 8 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control 5. 4x 2700W (2+2) Redundant Power Supplies, Titanium Level

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SYS-521GE-TNRT
Key Features Key Applications - High Performance Computing - VDI - AI/Deep Learning Training - Media/Video Streaming - Cloud Gaming - Animation and Modeling - Design & Visualization - 3D Rendering - Diagnostic Imaging Key Features 1. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 2. 13 PCIe Gen 5.0 X16 FHFL Slots AIOM/OCP 3.0 Support 3. 8x 2.5" Hot-swap SATA drive bays 8x HOT SWAP 2.5” SATA/SAS (AOC required) 8x2.5" Hot-swap NVMe drive bays 4. 8 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control 5. 4x 2700W (2+2) Redundant Power Supplies, Titanium Level

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AS-4125GS-TNRT1
Key Features Key Applications - AI / Deep Learning - High Performance Computing Key Features 1. Flexible GPU support: active & passive GPUs Single Root Configuration with PCIe Switch for up to 10 double width, full length GPUs 2. up to 8x 2.5" Hot-swap NVMe drive bays 3. AIOM / OCP 3.0 Support

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SYS-421GE-TNHR2-LCC
Key Features 1. 5th/4th Gen Intel® Xeon® Scalable processor support 2. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5 3. 8 PCIe Gen 5.0 X16 LP 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional) 4. Flexible networking options 5. 2 M.2 NVMe for boot drive only Optional: 8x 2.5" Hot-swap SATA drive bays 8x 2.5" Hot-swap NVMe drive bays 6. 4 heavy duty fans with optimal fan speed control 7. 4x 5250W(2+2) Redundant Power Supplies, Titanium Level

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AS -8125GS-TNMR2
Key Features 1. 8 NIC for GPU direct RDMA (1:1 GPU Ratio) High density 8U system with AMD Instinct MI300X 8-GPU 2. 24 DIMM Slots; Up to 6TB DRAM; 4800 ECC DDR5 LRDIMM;RDIMM; 3. 8 PCIe Gen 5.0 X16 LP, and up to 4 PCIe Gen 5.0 X16 FHFL Slots 4. Flexible networking options 5. 2x 2.5" Hot-swap SATA drive bays 1 M.2 NVMe for boot drive only up to 16x 2.5" Hot-swap NVMe drive bays (12 by default + 4 optional) 6. 10 heavy duty fans with optimal fan speed control 7. 6x 3000W redundant Titanium level power supplies

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SYS-821GE-TNHR
Views Angled ViewsTop ViewsFront ViewsRear Views Key Features Key Applications - High Performance Computing - AI/Deep Learning Training - Industrial Automation, Retail - Healthcare - Conversational AI - Business Intelligence & Analytics - Drug Discovery - Climate and Weather Modeling - Finance & Economics Key Features 1. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 2. 8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHFL Slots 3. Flexible networking options 4. 12x 2.5" Hot-swap NVMe drive bays 2 M.2 NVMe for boot drive only 8x 2.5" Hot-swap SATA drive bays 5. 10 heavy duty fans with optimal fan speed control 6. 6x 3000W (3+3) Redundant Power Supplies, Titanium Level Optional: 8x 3000W (4+4) Redundant Power Supplies, Titanium Level

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AS-8125GS-TNHR
Key Features Key Applications - High Performance Computing - AI/Deep Learning Training Key Features 1. 24 DIMM Slots; Up to 6TB DRAM ; 4800 ECC DDR5 LRDIMM;RDIMM 2. 8 PCIe Gen 5.0 X16 LP, 2 PCIe Gen 5.0 X16 FHFL Slots 3. Flexible networking options 4. 1 M.2 NVMe for boot drive only 12x 2.5" Hot-swap NVMe drive bays 2x 2.5" Hot-swap SATA drive bays 5. 10 heavy duty fans with optimal fan speed control 6. 8x 3000W redundant Titanium level power supplies

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SYS-821GV-TNR
1. 5th/4th Gen Intel® Xeon® Scalable processors With PCIE Gen 5 Platform GPU Memory Bandwidth: 3276.8 GB/s GPU Memory: 1TB HBM2 GPU to GPU Interconnect: 742 GB/s XeLink Scale Up Bandwidth High Density Computing: 8 x Intel® Data Center GPU Max 1550 (600W) OAM Open Ecosystem with oneAPI Performance: 6.7 petaFLOPS FP16/BF16 2. 32x DIMM slots, ECC DDR5 RDIMM up to 8TB and 5600MTS

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